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PrimeSilicon Technology Inc.
10080 N. Wolfe Rd., Suite SW3-282
Cupertino, CA 95014, USA

Email: info@primesilicon.com

PrimeSilicon Technology (BD) Ltd.
ENA Tower (Level-4), Plot: 57/3,
West Panthapath, Dhaka-1205, Bangladesh.

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Engineering the Future of Semiconductor Innovation

RTL-to-GDSII design and signoff since 2007 for any chip — from networking, optical and mobile SoCs to today’s AI accelerators.

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Powering Tomorrow's Chips, Today

We don’t hand off problems — we hand off signed-off GDSII. Timing, IR/EM, DRC/LVS and equivalence closed early, on nodes from TSMC 2nm and Samsung 4nm to 28nm.

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RTL to GDSII — Fastest Path to Tapeout

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Complete Documentation for Every Design Service

From RTL synthesis to sign-off — detailed technical documentation and proven flows for mixed-signal, low power, and high-speed design solutions.

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Trusted by Global Clients

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Engineering Support Throughout the Design Cycle

From RTL to tapeout — our engineers stay engaged at every stage to resolve timing, power, and verification challenges fast.

Fastest to Silicon — Since 2007

PST

PrimeSilicon is an application-specific integrated circuit (ASIC) design services company with proven expertise. Since it was founded in 2007 in San Jose, California, PrimeSilicon has provided ASIC design implementation services and solution consultation across many technology nodes to leading Silicon Valley-based companies. Our skilled FinFET-class team, with experience on chips down to 2nm, has delivered phenomenal chip design services with over 50 successful tapeouts.

In 2013, PrimeSilicon established its largest offshore design center in Dhaka, Bangladesh. This branch is led by engineers with an outstanding performance record across a multitude of projects, and doubles as an incubator for fresh graduates from the best technical universities in Bangladesh — supporting a large team of experienced, senior engineers.

We collaborate closely with our customers to provide exceptional service. By maintaining a highly interactive design program and reliable handoff models, we ensure every design obstacle is resolved swiftly and with remarkable quality.

Design Your Next Chip With 50+ Tapeouts Behind Us

Networking & Switching ASICsMobile & Low-Power SoCsAnalog & Mixed-SignalCoherent Optical DSPsAI AcceleratorsComposable AI ChipletsTSMC 2nm · Samsung 4nm50+ Tape-outsSigned-off GDSII

Delivering Silicon-Proven ASIC Design Since 2007

Proven design flows that take your chip from RTL to tapeout with zero surprises.

PrimeSilicon combines FinFET-class expertise with over 50 successful tapeouts on every kind of chip — networking, optical, mobile and AI silicon — across nodes from 28nm down to 2nm. We partner closely with our clients through handoff models and highly interactive design programs to resolve every design challenge swiftly and deliver silicon-ready results.

  • RTL Design
  • Synthesis
  • Digital Verification
  • RTL to GDSII Implementation
  • STA & Timing Closure
  • Low Power (UPF) Design
  • Analog Circuit Design
  • Circuit Design
  • Layout
  • Physical Verification (PV)
  • IR/EM Verification
  • Design for Test (DFT)
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Mission

Our mission is to help companies building any kind of chip — from mobile and networking SoCs to AI accelerators — reach tapeout faster and get it right the first time. We pair deep FinFET-node expertise, down to 2nm, with a hands-on engineering team that owns every step from RTL to GDSII.

 

First-time-right silicon for every chip — AI included

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Any Chip, Including AI Silicon

AI Accelerators

Training and inference silicon and composable AI chiplets: HBM, dense SRAM and aggressive clocks, with timing and congestion closed at scale.

Networking & Switching

Routing, switch and PCIe silicon — including high-radix switches for AI clusters — with wide buses, SerDes-heavy floorplans and multi-corner signoff.

Coherent Optical DSPs

DSPs that carry AI traffic over fiber, with timing and power integrity closed next to SerDes, ADC and DAC IP.

Mobile & Low-Power SoCs

Application processors and battery-critical SoCs closed with multi-domain UPF, clock gating and leakage control.

Signoff Without Surprises

Timing, IR/EM, DRC/LVS and equivalence closed early. You get signed-off GDSII, not open issues.

TSMC 2nm to 28nm

Hands-on flows from TSMC 2nm and Samsung 4nm to 28nm: no learning curve on your chip.

Precision Engineering Features Built for Every Tapeout

PST

Driving first-time-right silicon down to 2nm, PrimeSilicon merges FinFET-class precision, UPF low-power methodology, and battle-tested RTL-to-GDSII flows for top-tier semiconductor partners.

The Expertise & Advantages Behind Our Services

RTL Design

Synthesizable, lint- and CDC-clean RTL in Verilog and SystemVerilog — from micro-architecture to block integration, written with timing, power and area in mind from the start.

Synthesis

Logic synthesis with Genus, Fusion Compiler and DC-Topo — clean SDC constraints, timing-driven synthesis and formal equivalence before hand-off to place-and-route.

Digital Verification

Testbench development, simulation-based functional verification, coverage closure and formal equivalence — so the RTL is proven before it reaches physical design.

Full RTL-to-GDSII Coverage

End-to-end pipeline from RTL Development & Verification through full Place & Route (across 2, 4, 7, 11, 14, 22 and 28nm nodes) to Design Sign-off — for any chip, under a single, accountable team.

Analog Circuit Design

Transistor-level analog blocks — PLLs, bandgaps, LDOs, data-converter front-ends and I/O — designed and simulated across corners, then integrated cleanly into the SoC.

Circuit Design

Custom and full-custom digital circuits — standard cells, memories, TCAM and SRAM compilers and high-speed datapath blocks tuned at the transistor level.

Mixed-Signal Design (Flagship)

The hard analog blocks that let a digital SoC touch the real world — SerDes PHY, high-speed ADC & DAC converters, low-noise PLLs & VCOs, power-management units, and switching/linear regulators.

Layout

Analog and custom layout plus full-chip integration — matching, shielding and DRC/LVS-clean GDS from a dedicated team of layout engineers.

Low-Power Design

Power discipline built into both RTL and physical design from the first commit — RTL power intent, PD optimization, and leakage & clock gating.

Multi-Power Domain

Multi-threshold switching, frozen and verified for power correctness — Multi-Vt CMOS, IEEE-1801 UPF closure, and power-aware verification.

Very High-Speed Design

Multi-channel serial links and optical communication circuits — multi-channel Tx/Rx (CMOS), optical broadband, and high-speed IC characterization.

Design for Test (DFT)

Scan and MBIST insertion, DFT-mode SDCs and ATPG-ready netlists, planned together with physical design so test never costs timing.

IP Development

Silicon-proven building blocks that drop into a customer's SoC — SerDes & HBM wrappers, I/O libraries, and TCAM & SRAM compilers.

Flow Development

Custom place-and-route and sign-off flows, built to scale — hierarchical & flat PnR, DFT & bump automation, and auto-PV.

Flow Audit / QC

Independent checks that catch problems long before tape-out — integration & floorplan QC, clock-tree & DFT QC, and QoR analysis.

AI Silicon Experience

Training and inference accelerators, high-radix AI switch silicon, coherent DSPs for AI optical links and composable AI chiplets — on nodes down to TSMC 2nm.

Delivering Tapeouts on Every Kind of Chip — From Mobile SoCs to AI Accelerators

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Tapeouts
AI Accelerator Physical Design
AI Solution
AI Accelerator Physical DesignTraining and inference silicon with HBM, dense SRAM and aggressive clocksExplore more
Routing & Switching Silicon for AI Networks
Development
Routing & Switching Silicon for AI NetworksRouting and switching silicon for service-provider, web-scale and AI networksExplore more
Coherent DSP & Optical Interconnect Integration
Integration
Coherent DSP & Optical Interconnect IntegrationCoherent DSPs and fiber-optic chips: the links that carry AI trafficExplore more

Insights from the World of ASIC Design and Silicon Engineering

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December 25, 2024
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Full Chip Timing Closure: Avoiding Disasters Before Tapeout

Why full-chip timing closure has to start early — and the sign-off habits that keep advanced-node tapeouts on schedule.
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January 2, 2025
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How UPF-Based Low Power Methodology Prevents Costly Re-Spins

How a disciplined UPF power-intent flow catches low-power bugs before they turn into expensive silicon re-spins.

Take Your Next Chip from RTL to Tapeout with Confidence 

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PrimeSilicon's team caught issues weeks before they became costly. Their communication throughout the tapeout was exceptional.

Attila Kovacs Director of Engineering , Clariphy communications

PrimeSilicon's PNR methodology is rock solid. Clean floorplans, tight timing closure, and clear documentation every step of the way.

Rajat Goel Director of Engineering, Akeana inc.

Discover What Our Clients Have to Say About Working With PrimeSilicon

Years of ASIC Design Excellence
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We Are Always Ready to Help You and  Answer Your  Questions

Reach out to our Cupertino headquarters — 10080 N. Wolfe Rd., Suite SW3-282, Cupertino, CA 95014, United States. Our team is ready to discuss your next tapeout.

Email

info@primesilicon.com

Our Location

PrimeSilicon Technology Inc.
10080 N. Wolfe Rd.
Suite SW3-282 , Cupertino , CA 95014 , United States

PrimeSilicon Technology (BD) Ltd.     ENA Tower (Level-4), Plot 57/3, West Panthapath, Dhaka-1205, Bangladesh

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  • BangladeshPrimeSilicon Technology (BD) Ltd.Level-4, 57/3 4, ENA Tower, West Panthapath Rd, Dhaka 1205, Bangladesh
  • United StatesPrimeSilicon Technology Inc.10080 N. Wolfe Rd., Suite SW3-282, Cupertino, CA 95014, United States
  • MalaysiaPrimeSilicon TechnologyPenang, Pulau Pinang, Malaysia
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