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PrimeSilicon Technology Inc.
10080 N. Wolfe Rd., Suite SW3-282
Cupertino, CA 95014, USA

Email: info@primesilicon.com

PrimeSilicon Technology (BD) Ltd.
ENA Tower (Level-4), Plot: 57/3,
West Panthapath, Dhaka-1205, Bangladesh.

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Proven on Your Node: 2nm to 28nm

Projects

Brief and project description

Hands-on flows from TSMC 2nm and Samsung 4nm to 28nm. Client tape-outs on TSMC 2/5nm, 7nm and 16/28nm and on Samsung 4/5/7nm, 8LPP and 14nm mean there is no learning curve on your chip.

  • RTL to GDSII physical implementation
  • PV: block and chip level verification
  • STA full chip timing closure

Process

Every tapeout starts with a methodology review: we align on the foundry PDK, sign-off corners, power intent and hand-off model before a single cell is placed. From there our engineers own floorplanning, power-grid design, placement, clock-tree synthesis and routing — iterating closely with the client's RTL and architecture teams.

Sign-off runs in parallel, not at the end. Static timing across all corners, IR-drop and electromigration analysis, and block- and chip-level physical verification are tracked every week, so the final stretch before tapeout is about confirmation rather than discovery.

Key Outcomes

The same disciplined flow has carried designs across successive foundry generations — from 28nm planar through 16nm and 7nm FinFET to today's 2nm-class nodes — and is now applied to the AI accelerators and high-bandwidth interconnect chips our clients are building.

Successful Tapeouts
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Years of ASIC Design Excellence
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